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International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems

Mode: Offline Conference Date: 2023-10-24 Views : 173


Institute: Doubletree by Hilton San Diego Mission Valley, San Diego, CA
Mode: Offline
Start Date: 2023-10-24
End Date: 2023-10-26
Coordinator: ASME Technical Program Manager Mary Jakubowski JakubowskiM@asme.org Senior Manager, Technical & Engineering Communities (TEC) Operations Barbara Zlatnik ZlatnikB@asme.org WebTool Specialist Laraine "Lori" Lee LeeL@asme.org
Paid/Free: Paid
Call for Papers Heterogeneous Integration Data Centers and Modular Edge Systems Electronics Packaging Power/RF Electronics and Photonics Multiscale Thermal Transport and Energy Storage Flexible, Wearable, and Printed Electronics Transportation Systems, AI and Machine Learning Interactive Presentations Track 9: Panels, Tutorials, and Workshops
Web-URL: https://event.asme.org/InterPACK
Status:

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