(THERMINIC 2023 )29th International Workshop On Thermal Investigations Of ICs And Systems

Mode: online Conference Date: 2023-09-27 Views : 81

Mode: Online
Start Date: 2023-09-27
End Date: 2023-09-29
Coordinator: Local Conference Service mcc Agentur für Kommunikation GmbH Bülowstr. 66, Aufgang D1 10783 Berlin, Germany Email: therminic[at]mcc-events.de Web: www.mcc-events.de Phone: +49 30 6128 8611
Paid/Free: Paid
Call for Papers Thermal Phenomena in Simulation & Experiment: Thermal management of electronic components and systems Classical and modern thermometry and thermography Thermal interface materials and their characterisation Thermal modelling and investigation of packages Nano-scale heat transfer Multi-physics simulation and field coupling Electro-thermal modelling and simulation CFD modelling and benchmarking Advanced thermal materials and technologies Numerical methods for multi-scale heat transfer Use of novel, advanced mathematics and statistics concepts / AI methods for complex digital twins
Web-URL: https://therminic2023.eu/